Adhesion Measurement Methods for Thin Films in Microelectronics

Novel Adhesion Test for Environmentally Assisted Fracture in Thin Films

Thin films, used in various applications and devices, must strongly adhere to their substrates. Due to various processing and storage environments that devices can be exposed to, water may be introduced into the system. If residual stresses are present in a thin film, delamination propagation can be driven by water without the assistance of an externally applied mechanical force. It is extremel...

Laser methods for deposition of Teflon thin films and modification of Teflon’s adhesion properties PhD thesis

Contact instability in adhesion and debonding of thin elastic films.

Based on experiments and 3D simulations, we show that a soft elastic film during adhesion and debonding from a rigid flat surface undergoes morphological transitions to pillars, labyrinths, and cavities, all of which have the same lateral pattern length scale, lambda close to lambda/H approximately 3 for thick films, H > 1 microm . The linear stability analysis and experiments show a new thin f...

Adhesion Dynamics in Probing Micro- and Nanoscale Thin Solid Films

This study focuses on modeling the probe dynamics in scratching and indenting thin solid films at microand nanoscales. The model identifies bifurcation conditions that define the stick-slip oscillation patterns of the tip. It is found that the local energy fluctuations as a function of the inelastic deformation, defect formation, material properties, and contact parameters determine the oscilla...

Original Methods for Diffusion Measurements in Polycrystalline Thin Films

With the development of nanotechnologies, the number of industrial processes dealing with the production of nanostructures or nano-objects is in constant progress (microelectronics, metallurgy...). Thus, knowledge of atom mobility and the understanding of atom redistribution in nano-objects and during their fabrication have become subjects of increasing importance, since they are key parameters...